Kyocera showcases its semiconductor solutions at EMPC 2025

Semiconductor components for a wide range of applications

As the demand for semiconductor solutions continues to grow in numerous industries, Kyocera is focusing on developing versatile products that can be used in a wide variety of applications. The focus is on the following areas:

• Quantum technologies: Designed for quantum computing, sensing, and secure communication, quantum technologies play an important role in sectors such as finance, medicine, chemistry and the automotive industry. Qubits, the core units of quantum information, allow for significantly faster and more complex calculations, along with highly sensitive magnetic field measurements. Kyocera offers advanced ceramics and assembly technologies to support these applications.
• Aerospace: Aerospace applications require circuity and must work reliably and accurately, even in special environments. Kyocera’s ceramic packaging assists in the provision of these requirements and with the addedadvantage of hermeticity, stable dielectric properties as well as low-loss interconnects in a mechanically robust 3D or planar structure. As aerospace moves toward more integrated and power-efficient electronics, Kyocera’s solutions provide the needed scalability and durability.
• Data transfer: Connectivity needs fast and reliable data transfer to deploy its vast possibilities, including Industrial IoT, smart healthcare, and autonomous mobility. Kyocera contributes essential components for next-generation data highways, such as fiber optic Ethernet, and 5G/6G millimeter wave technologies.
• Sensor packaging: With Kyocera’s tailored packaging technologies, clients can achieve improved sensor performance and meet specific technical criteria.
• High class and low-cost ceramic technology: High class and low-cost ceramic technology: Kyocera offers a variety of packages to meet market demands and provide full support of high design technology aiming to provide optimized packaging solutions for the individual requirements of every client. For example, a thinner, smaller surface mount type leadless package as well as other customized design structures are available for MEMS which have an open air cavity structure or other specifications. The MEMS sensors are used in the Automotive sector, for example in the Electronic Stability Control (ESC) or in the Advanced Driver Assistance Systems (ADAS), and in the consumer field, for example in wearable devices or 3D virtual reality.

Collaboration as a factor for success

Kyocera International Inc. has been providing electronic packaging and assembly services to different industries for over 60 years. With the continuous expansion of its capacities, the company strives to meet the growing challenges of the semiconductor industry. By combining substrate and package designs, the company provides solutions with optimized assembly processes for Kyocera's semiconductor solutions. The custom assembly service offers not only design and development support but also bill of materials (BOM) procurement and a wide selection of substrate and circuit board materials.

Overview – Kyocera at the EMPC 2025

The European Microelectronics & Packaging Conference (EMPC 2025) is the leading international event for microelectronics packaging, assembly and interconnection technologies in Europe. The conference will take place from 16th to 18th of September 2025 in Grenoble, France, and will offer a high-quality technical programme, keynote speeches and a large trade exhibition featuring cutting-edge technologies and innovative solutions. Organized and sponsored by IMAPS-Europe in cooperation with IEEE-EPS, it brings together leading industry representatives, researchers, innovators and technology, business and marketing experts from around the world.