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Kyocera showcases quantum tech innovations at Quantum Effects 2024

Kyocera participates at the Quantum Effects trade fair taking place in Stuttgart, Germany, unveiling its advanced material solutions for quantum technologies.

  • Fine Ceramic Components
  • Semiconductor Components

Kyoto/London − Kyocera is set to participate in Quantum Effects 2024 (Hall C2, Booth #2E31), taking place from October 8-9 in Stuttgart, Germany. The company will be unveiling its innovative material solutions that are accelerating the progression of quantum technologies across various industries, including finance, medicine, automotive, chemical sectors, and quantum sensing applications.

Kyocera’s role in shaping quantum technologies

Kyocera is developing a range of ceramic packaging solutions and assembly options, offering excellent thermal management and hermetic solution, thereby facilitating stable and scalable qubits*1. The company's diverse materials, including HTCC and LTCC multilayer ceramic substrates and AlN carriers, offer superior heat dissipation and plating options. This enables low magneticity and brazing material with low permeability, which are crucial for the development and functioning of quantum technologies.

Meeting connection requirements and ensuring quantum state stabilization

Kyocera’s packages offer a variety of connection solutions for 2nd assembly such as Pin Grid Array (PGA) packages, and Land Grid Array (LGA) packages. Kyocera offers die assembly service for wire bonding and flip chip technology. Kyocera also provides materials for hermetic sealing, including “Ceramic to Metal” and “Metal to Metal” brazing materials, along with vacuum sealing packaging to support the stabilization of the quantum state.

Saphire wafer: A game-changer

Kyocera's sapphire wafer, produced with superior crystallinity, is expected to result in lower dielectric loss and excellent thermal conductivity at ultra-low temperatures, marking a significant advancement in quantum technology.

Kyocera’s commitment to quantum technologies

With a firm commitment to shaping the future of quantum technologies, Kyocera continues to provide a range of customized solutions to meet the diverse requirements of different qubit technologies and their applications. Ceramic materials have been investigated for use in harsh environmental applications for several decades. We are confident that our cutting edge technology will support our customers' advancements in quantum technologies.

Overview: Kyocera at Quantum Effects

Show Quantum Effects 2024
Hall C2, Booth #2E31
Date 8 – 9 October 2024
Location Messe Stuttgart, Germany

*1 Qubits, the basic unit of quantum information, process information differently from traditional binary bits. They enable more complex, faster calculations and ultra-high sensitive measurements of magnetic fields. This disruptive potential holds promise for numerous sectors.

Kyocera_Wire_bonding_fuer_QPU_Chip.jpg
Wire bonding substrate for QPU chip

Kyocera_Flip_Chip_Substrat_fuer_QPU_Chip.jpg
Flip chip substrate for QPU chip
Kyocera_Hermetisch_dichte_Abdeckung_mit_Fenstern.jpg
Hermetic seal lid with windows for trapped ion
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HTCC PGA package
Kyocera_LTCC_Substrat.jpg
LTCC LGA package
Kyocera_AlN_Traegersubstrat.jpg
AIN carrier



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