21 September 2023

Kyocera showcases quantum tech innovations at Quantum Effects 2023

• Fine Ceramic Components
• Semiconductor Components

Kyocera’s role in shaping quantum technologiesKyocera is developing a range of ceramic packaging solutions and assembly options, offering excellent thermal management and potential miniaturization of different components, thereby facilitating stable ...

20 June 2023

Kyocera presents its products at The Advanced Ceramics Show 2023

• Automotive Components
• Fine Ceramic Components
• Semiconductor Components

KYOCERA Fineceramics Ltd. presents its semiconductor components, fine ceramic and automotive components at the exhibition and conference taking place on June 28-29 in Birmingham, UK.

Kyocera’s product range at The Advanced Ceramics Show 2023 At the exhibition and conference, Kyocera will be represented by several product categories:1. Semiconductor components 2. Fine ceramic components (KYOCERA Fineceramics Europe GmbH)3. Automot...

20 April 2023

Kyocera to acquire construction site in Japan for new smart factory

• Corporate
• Fine Ceramic Components
• Semiconductor Components

Most state-of-the-art Kyocera facility will be constructed on about 15 hectares in Isahaya, Nagasaki Prefecture, to feature new automotive and communication innovations.

Construction begin in October 2023 Kyocera, which is reinvesting in its existing factories both in Japan and abroad, decided to build the new plant in December 2022 after determining that rising market demand will require additional production capabi...

10 January 2023

Kyocera plans new manufacturing plant in Japan’s Nagasaki Prefecture by 2026

• Corporate
• Semiconductor Components

Company envisions up to 1,000 jobs in Isahaya City as other sites near full capacity.

High level of investment Kyocera aims to achieve sales of JPY 2 trillion (around 13.755 billion Euro) in its current fiscal year (ending March 31, 2023) and has set a long-term sales target of JPY 3 trillion (around 20.628 billion Euro) by the fiscal...

11 November 2022

Kyocera’s new “On-Board Optics Module” achieves world-record bandwidth, reduces power consumption for data centers

• Corporate
• Semiconductor Components

Prototype in development sets world-record 512 Gbps bandwidth*.

Kyocera’s prototype module is miniaturized for installation on a printed circuit board near the processor, allowing electronic data to be converted into optical signals instantaneously. In addition, the product is designed to create unprecedented imp...

05 May 2022

Kyocera to build its largest plant in Japan, increasing production of semiconductor components

• Corporate
• Semiconductor Components

Expanded Sendai Plant Campus in Kagoshima will meet increasing demand for semiconductor packages powering ADAS, sensor cameras, 5G and more.

Three converging factors are creating strong demand for Kyocera’s organic semiconductor packages and crystal device packages. Smart vehicles are expanding the need for automotive cameras and high-performance processors used in Advanced Driver-Assista...

30 October 2018

Kyocera presents a firework display of innovations at the electronica 2018

• Automotive Components
• Electronic Components & Devices
• Fine Ceramic Components
• LCDs and Touch Solutions
• Organic Materials
• Semiconductor Components

Once again Kyocera presents its diverse product range - from displays to semiconductor components - at the electronica in Munich. The manufacturer is located at stand 536 in Hall B6 from the 13th to 16th of November.

0.5 mm-pitch FPC/FFC connectors 6892 series Industry 4.0: Clear perspective and tangible feedbackThe Kyocera display division shows innovative micro-LEDs for the first time. Differently to LCDs, micro-LED pixels are self-illuminating and consis...

04 October 2018

KYOCERA Group to Exhibit Innovative Technologies and Products at CEATEC JAPAN 2018 Tradeshow Oct. 16-19

• Automotive Components
• Electronic Components & Devices
• Fine Ceramic Components
• LCDs and Touch Solutions
• Organic Materials
• Semiconductor Components

From automotive technologies to energy management solutions, a wide range of Kyocera’s technologies for connected society will be on display

Mobility A safe and comfortable mobility society will be realized through advanced driver assistance systems and connected-car solutions. The latest systems utilizing Kyocera’s advanced devices infused with Artificial Intelligence (AI), Augmente...

13 August 2018

KYOCERA designs and manufactures new ultra-small robust ceramic UHF RFID Tags for tool tracking in Aerospace industry

• Semiconductor Components

KYOCERA’s new ultra-high frequency RFID transponder is appliable to metal and – due to its robust ceramic package – suitable for reliable tool tracking within the aerospace industry.

UHF RFID tag In order to avoid FOD, Kyocera’s robust ceramic UHF RFID tags are especially suited to identification and tracking of metal tools in the aerospace industry. RFID tags will be attached to workshop tools of MRO service providers in or...

19 June 2018

KYOCERA designs and manufactures new ultra-small robust ceramic UHF RFID Tag to trace surgical instruments for the Medical Market

• Semiconductor Components

Kyocera’s ultra-high frequency (UHF) RFID transponders are applicable on metal and - due to their ceramic packages - suitable for sterilization processes of surgical instruments in hospitals involving high temperatures, humidity and chemical exposure.

About Kyocera’s robust ceramic UHF RFID Tag The new product offers a robust package made of Low Temperature Co-fired Ceramic (LTCC) with embedded antenna that withstands high temperatures up to 300°C (depending on RFID tag structure) and hum...

29 March 2018

KYOCERA to Build New Plant in Kagoshima, Japan, for Ceramic Microelectronic Packages

• Corporate
• Semiconductor Components

New facility will produce ceramic packages for electronic and semiconductor components, including SMD and CMOS devices, to support IoT growth

Architect's rendering The new facility, which Kyocera plans to open in August 2019, will bring a 25 percent increase in the company’s total production capacity for ceramic packages used to house SMD*1 electronic devices and CMOS*2 image sensors....