29 March 2018

KYOCERA to Build New Plant in Kagoshima, Japan, for Ceramic Microelectronic Packages

• Corporate
• Semiconductor Components

New facility will produce ceramic packages for electronic and semiconductor components, including SMD and CMOS devices, to support IoT growth

Architect's rendering The new facility, which Kyocera plans to open in August 2019, will bring a 25 percent increase in the company’s total production capacity for ceramic packages used to house SMD*1 electronic devices and CMOS*2 image sensors....