Network / Infrastructure
Tailored for your best practice: Organic (HDBU) and ceramic (HITCE®) technology
Kyocera offers different technologies on the edge of physics to support fastest application products - highest speed, highest frequency.
Considering tight density routing, electrical performance and all level reliability, Kyocera substrates are outstanding in quality to push your products to leading position worldwide.
Features
- Finest design rules (9/12 µm), high stack-up (up to 8 layers) and large OD for best electrical performance
- Low loss materials
- High reliability
- Various surface finish options (Ni/Au, SAC soldering, etc.)
- Support of high speed (> 32Gbps)
- Stable material properties over frequency
- 2nd level reliability
Reference markets
IT infrastructure
High performance computers, network equipment (Server), base transceiver stations
Switching & interconnect
ASICs for servers/routers, MPUs for high performance graphics processors, etc.
Download
- Flyer "High-density Multilayer PWBs" (1,15 MB)
- Flyer "Embedded Components Technology" (691,44 KB)
- Flyer "High-density PWBs for SiP Modules" (894,33 KB)