Camera Image Sensors
Features
- High thermal dissipation (with ou without heat sink)
- Low dust contamination with ceramic than PCB
- High pin count multilayer package (Cerquad, LGA, PGA, LCC, etc)
- Cavity structure and large-sized substrate
- Controlled flatness (grinding process)
- Glass lid with optical coating (T.C.E. matching with alumina)
- Assembly service
